Patent Assignment
Reel/Frame 027051/0727
Assignment of Assignor's Interest
Recorded: 2011-10-12
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2011-09-28
WANG, TSUNG-DING
Executed: 2011-09-28
LEE, CHIEN-HSIUN
Executed: 2011-09-28
TSAI, HAO-YI
Executed: 2011-09-28
LII, MIRNG-JI
Executed: 2011-09-28
YU, CHEN-HUA
Executed: 2011-09-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Wafer-Level Chip Scale Package with Re-Workable Underfill