Patent Assignment
Reel/Frame 027066/0303
Assignment of Assignor's Interest
Recorded: 2011-10-14
Pages: 4
Assignor
LG ELECTRONICS INC.
Executed: 2009-12-02
Assignee
LG INNOTEK CO., LTD.
33 FL., LG TWIN TOWER WEST, 20, YEOUIDO-DONG, YONGDUNGPO-GU, SEOUL, 150-721, KOREA, REPUBLIC OF
Covered Properties
(4)
Chip Mounting Structure Having Adhesive Conductor
Patent:
6,509,634 →
Application:
09/667,008 →
Method for Fabricating Printed Circuit Board
A Method for Plugging Holes in a Printed Circuit Board
Hole Plugging Method for Printed Circuit Boards, and Hole Plugging Device
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 21, 2000
From: LEE, SUNG-GUE; KIM, YONG-IL
To: LG ELECTRONICS INC.
Reel/Frame 011136/0842 →
Assignment of Assignor's Interest
Jun 15, 2001
From: KIM, NAM-JIN; AHN, YOUNG-CHEOL; KIM, WON-JE
To: LG ELECTRONICS INC.
Reel/Frame 011901/0708 →
Corrective Assignment to Correct the Third Assignor's Name Previously Recorded on Reel 011901 Frame 0708
Oct 17, 2001
From: KIM, NAM-JIN; AHN, YOUNG-CHEOL; KIM, WON-JAE
To: LG ELECTRONICS INC.
Reel/Frame 012259/0296 →
Assignment of Assignor's Interest
Jan 14, 2002
From: LEE, SUNG GUE; CHO, SUNG SIK; KIM, YONG II; JANG, YONG SOON
To: LG ELECTRONICS INC.
Reel/Frame 012473/0696 →