Patent Assignment
Reel/Frame 027069/0066
Assignment of Assignor's Interest
Recorded: 2011-10-17
Pages: 5
Assignors
LIU, YU-CHIH
Executed: 2011-08-23
LU, JING RUEI
Executed: 2011-08-23
LIN, WEI-TING
Executed: 2011-08-23
CHIU, SAO-LING
Executed: 2011-08-24
PAN, HSIN-YU
Executed: 2011-08-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Flip-Chip Bga Assembly Process