Patent Assignment
Reel/Frame 027107/0806
Assignment of Assignor's Interest
Recorded: 2011-10-24
Pages: 2
Assignors
YIM, CHOONG-BIN
Executed: 2011-09-26
CHOI, DAE-YOUNG
Executed: 2011-09-26
KIM, MI-YEON
Executed: 2011-09-29
PARK, JI-YONG
Executed: 2011-09-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, GYEONGGI-DO,, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Type Semiconductor Package and Method of Fabricating the Same