Patent Assignment
Reel/Frame 027121/0922
Assignment of Assignor's Interest
Recorded: 2011-10-26
Pages: 8
Assignors
KELKAR, AMIT SUBHASH
Executed: 2011-10-20
THAMBIDURAI, KARTHIK
Executed: 2011-10-20
KHANDEKAR, VIREN
Executed: 2011-10-20
NGUYEN, HIEN D.
Executed: 2011-10-25
Assignee
MAXIM INTEGRATED PRODUCTS, INC.
120 SAN GABRIEL DRIVE, SUNNYVALE, CALIFORNIA, 94086
Covered Property
(1)
Three-Dimensional Chip-to-Wafer Integration