IP Library › Assignment 027129/0371
Patent Assignment
Reel/Frame 027129/0371

Security Agreement

Recorded: 2011-10-26 Received: 2011-10-26 Pages: 13
Assignor
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
270 PARK AVENUE, NEW YORK, NY, 10017, UNITED STATES
Covered Properties (17)
Current Sensing Devices and Methods
Application: 12/954,546 →
Advanced Electronic Header Apparatus and Methods
Application: 61/413,913 →
Universal Connector Assembly and Method of Manufacturing
Application: 12/871,801 →
Modular Electronic Header Assembly and Methods of Manufacture
Application: 12/777,186 →
Universal Connector Assembly and Method of Manufacturing
Application: 12/705,949 →
Current Sensing Inductive Devices
Application: 12/684,056 →
Form-Less Electronic Device Assemblies and Methods of Operation
Application: 12/572,168 →
Current Sensing Devices and Methods
Application: 12/567,622 →
Substrate Inductive Devices and Methods
Application: 12/503,682 →
Power-Enabled Connector Assembly and Method of Manufacturing
Application: 12/495,653 →
Universal Connector Assembly and Method of Manufacturing
Application: 12/151,343 →
Self-leaded surface mount inductors and methods
Application: 12/012,157 →
Low-Profile Connector Assembly and Methods
Application: 12/011,796 →
Impedance Blocking Filter Circuit
Application: 10/748,729 →
Impedance Blocking Filter Circuit
Application: 10/408,030 →
Impedance Blocking Filter Circuit
Application: 10/366,656 →
Modular Jack Assembly with Signal Conditioning
Application: 10/209,377 →