IP Library › Assignment 027141/0377
Patent Assignment
Reel/Frame 027141/0377

Assignment of Assignor's Interest

Recorded: 2011-10-28 Pages: 9
Assignors
BERGEMONT, ALBERT
Executed: 2011-10-24
SRIDHAR, UPPILI
Executed: 2011-10-25
ELLUL, JOSEPH
Executed: 2011-10-26
SUN, YI-SHENG ANTHONY
Executed: 2011-10-24
SIMONS, ELLIOTT
Executed: 2011-10-26
Assignee
MAXIM INTEGRATED PRODUCTS, INC.
120 SAN GABRIEL DRIVE, SUNNYVALE, CALIFORNIA, 94086
Covered Property (1)
3D Chip Package with Shielded Structures
Patent: 8,686,543 →
Application: 13/284,116 →
Publication: US 2013/0105950