IP Library › Assignment 027151/0682
Patent Assignment
Reel/Frame 027151/0682

Assignment of Assignor's Interest

Recorded: 2011-10-31 Pages: 3
Assignor
HU, GUOJUN
Executed: 2011-10-19
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Self Repairing Ic Package Design
Patent: 8,148,829 →
Application: 12/650,411 →
Publication: US 2011/0156234
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 22, 2010
From: HU, GUOJUN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 023971/0897 →
Assignment of Assignor's Interest Oct 31, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027150/0717 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →