Patent Assignment
Reel/Frame 027158/0275
Corrective Assignment to Correct the Omission of Conveying Parties Who Executed the Assignment Previously Recorded on Reel 007223 Frame 0611. Assignor(S) Hereby Confirms the Addition of Conveying Parties: Sigmund a. Koenigseder, Landon B. Vines, Chang-Ou Lee, and Felix Fujishiro.
Recorded: 2011-11-01
Pages: 6
Assignors
CAIN, JOHN L.
Executed: 1994-08-12
KOENIGSEDER, SIGMUND A.
Executed: 1994-08-11
VINES, LANDON B.
Executed: 1994-08-15
LEE, CHANG-OU
Executed: 1994-08-15
FUJISHIRO, FELIX
Executed: 1994-08-15
Assignee
VLSI TECHNOLOGY, INC.
1109 MCKAY DRIVE, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Densification in an Intermetal Dielectric Film
Patent:
5,610,105 →
Application:
08/258,180 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2009
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 022973/0239 →
Change of Name
Jul 18, 2009
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 022973/0248 →
Change of Name
Jul 18, 2009
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 022973/0254 →
Assignment of Assignor's Interest
Jan 10, 2012
From: NXP SEMICONDUCTORS N.V. ON BEHALF OF ITSELF AND ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: INVENSAS CORPORATION
Reel/Frame 027545/0060 →