Patent Assignment
Reel/Frame 027161/0091
Assignment of Assignor's Interest
Recorded: 2011-11-02
Pages: 6
Assignors
KHANDEKAR, VIREN
Executed: 2011-11-02
THAMBIDURAI, KARTHIK
Executed: 2011-11-02
SRIDHARAN, VIVEK SWAMINATHAN
Executed: 2011-11-02
Assignee
MAXIM INTEGRATED PRODUCTS, INC.
120 SAN GABRIEL DRIVE, SUNNYVALE, CALIFORNIA, 94086
Covered Property
(1)
Wafer-Level Chip-Scale Package Device Having Bump Assemblies Configured to Maintain Standoff Height
Patent:
10,804,233 →
Application:
13/287,254 →