Patent Assignment
Reel/Frame 027162/0457
Assignment of Assignor's Interest
Recorded: 2011-11-02
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3F, 157 LI-TE RD., PEITOU DISTRICT, TAIPEI CITY, 11259, TAIWAN
Covered Property
(1)
Stackable Semiconductor Assembly with Bump/Flange Heat Spreader and Dual Build-Up Circuitry