Patent Assignment
Reel/Frame 027165/0157
Assignment of Assignor's Interest
Recorded: 2011-11-02
Pages: 3
Assignors
GAN, KAH WEE
Executed: 2011-10-20
HUANG, YAOHUANG
Executed: 2011-10-20
JIN, YONGGANG
Executed: 2011-10-20
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Embedded Wafer Level Package for 3D and Package-on-Package Applications, and Method of Manufacture
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.