IP Library Assignment 027169/0831
Patent Assignment
Reel/Frame 027169/0831

Assignment of Assignor's Interest

Recorded: 2011-11-03 Pages: 10
Assignors
JI, QING
Executed: 2006-06-15
CHAN, CHEW B.
Executed: 2006-06-15
YUN, HWANG K.
Executed: 2006-06-15
ZHAO, RENZHE
Executed: 2006-06-15
SHI, WEITONG
Executed: 2006-08-11
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property (1)
Low Exothermic Thermosetting Resin Compositions Useful as Underfill Sealants and Having Reworkability
Patent: 8,075,721 →
Application: 12/091,094 →
Publication: US 2008/0285247
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034184/0396 →
Assignment of Assignor's Interest Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0776 →