Patent Assignment
Reel/Frame 034184/0396
Assignment of Assignor's Interest
Recorded: 2014-11-07
Pages: 45
Assignor
HENKEL CORPORATION
Executed: 2014-11-06
Assignee
HENKEL US IP LLC
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Properties
(144)
Moisture-Curable Polyurethane Hotmelt Adhesives with High Green Strength
Patent:
6,136,136 →
Application:
07/982,203 →
Bismaleimide-Divinyl Adhesive Compositions and Uses Therefor
Patent:
6,034,194 →
Application:
08/300,721 →
Reactive Hot Melt Foam
Patent:
5,616,625 →
Application:
08/390,443 →
Low Application Temperature Hot Melt Adhesive
Patent:
5,500,472 →
Application:
08/390,725 →
Sucrose Benzoate as a Tackifier for Water Sensitive or Biodegradable Hot Melt Adhesives
Patent:
5,574,076 →
Application:
08/433,285 →
Hot Melt Adhesives Based on Hydroxy-Functional Polyesters
Patent:
5,583,187 →
Application:
08/433,578 →
Thermosetting Resin Compositions Containing Maleimide and/or Vinyl Compounds
Patent:
6,034,195 →
Application:
08/460,495 →
Bleed Resistant Cyanate Ester-Containing Compositions
Patent:
5,646,241 →
Application:
08/475,006 →
Polyglydicylphenyl Ethers of Alkyeoxy Chains for Use in Micro- Electronics Adhesives
Patent:
5,646,315 →
Application:
08/656,597 →
Epoxy Resins Consisting of Flexible Chains Terminated with Glycidyloxyphenyl Groups for Use in Microelectronics Adhesives
Patent:
5,717,054 →
Application:
08/656,619 →
Snap-Cure Epoxy Adhesives
Patent:
5,770,706 →
Application:
08/656,621 →
Perfluorinated Hydrocarbon Polymer-Filled Adhesive Formulations and Uses Therefor
Patent:
5,717,034 →
Application:
08/688,206 →
Adhesive Thermal Interface and Method of Making the Same
Patent:
5,904,796 →
Application:
08/760,468 →
Dissipative Laminating Adhesive
Patent:
5,717,015 →
Application:
08/799,655 →
Bleed Resistant Cyanate Ester-Containing Compositions
Patent:
5,718,941 →
Application:
08/811,554 →
Epoxy-Containing Die-Attach Compositions
Patent:
5,969,036 →
Application:
08/879,580 →
Hydrophobic Vinyl Monomers, Formulations Containing Same, and Uses Therefor
Patent:
6,121,358 →
Application:
08/935,352 →
Snap-Cure Epoxy Adhesives
Patent:
5,854,315 →
Application:
08/951,875 →
Method for the Preparation of Maleimides
Patent:
5,973,166 →
Application:
09/033,432 →
Snap-Cure Epoxy Adhesives
Patent:
5,856,383 →
Application:
09/073,089 →
Moisture Curable Hot Melt Adhesive and Method for Bonding Substrates Using Same
Patent:
6,221,978 →
Application:
09/288,899 →
Hydrophobic, High Tg Cycloalphatic Epoxy Resins
Patent:
6,429,281 →
Application:
09/347,091 →
Low Viscosity Acrylate Monomers Formulations Containing Same and Uses Therefor
Patent:
6,211,320 →
Application:
09/362,809 →
Adhesive Compositions with Retarding Additive
Patent:
6,291,593 →
Application:
09/452,626 →
Flame Retardant Molding Compositions
Patent:
6,432,540 →
Application:
09/532,423 →
Novel Heterobifunctional Monomers and Uses Therefor
Patent:
6,423,780 →
Application:
09/779,396 →
Radical Polymerizable Compositions Containing Polycyclic Olefins
Moisture-Curable Polyurethane Hot Melt Adhesives Containing Reactive Amine Catalysts
Adhesive Composition
Patent:
6,433,091 →
Application:
09/852,961 →
Heat Sink and Thermal Interface Having Shielding to Attenuate Electromagnetic Interference
Thermal Interface Wafer and Method of Making and Using the Same
Benzoxazines, Thermosetting Resins Comprised Thereof, and Methods for Use Thereof
Adhesive Compositions Containing Organic Spacers and Methods for Use Thereof
Flame Retardant Molding Compositions
Film Adhesives Containing Maleimide Compounds and Methods for Use Thereof
Zinc Phosphating Process and Composition with Reduced Pollution Potential
Patent:
6,620,263 →
Application:
10/129,299 →
Low Shrinkage Thermosetting Resin Compositions and Methods of Use Thereof
Free Radically Polymerizable Coupling Agents
Aqueous Adhesive Composition
Patent:
6,998,435 →
Application:
10/277,412 →
Organic Acid Containing Compositions and Methods for Use Thereof
Latent Catalysts for Molding Compounds
Patent:
6,822,341 →
Application:
10/325,813 →
Low Shrinkage Thermosetting Resin Compositions and Methods of Use Therefor
Flame-Retardant Molding Compositions
B-Stageable Die Attach Adhesives
Compositon of Bulk Filler and Epoxy-Clay Nanocomposite
Room Temperature Curable Water-Based Mold Release Agent for Composite Materials
Curable Coating Compositions
Novel Heterobifunctional Monomers and Uses Therefor
Conductive Ink Compositions
Patent:
7,037,447 →
Application:
10/626,008 →
Dispensing Actuator for Pressurized Container
Thermal Interface Wafer and Method of Making and Using the Same
Benzoxazines, Thermosetting Resins Comprised Thereof, and Methods for Use Thereof
Ultra Low Density Thermally Clad Microspheres and Method of Making Same
Polyamides
Polyamides
Corrosion Protective Methacrylate Adhesives for Galvanized Steel and Other Metals
Low misting laminating adhesives
Hot Melt Pressure Sensitive Adhesives
Patent:
7,442,739 →
Application:
10/990,728 →
Laminating Adhesives Based on Triglyceride-Derived Polyols
Toughened Two-Part Adhesive Compositions Demonstrating Improved Impact and/or Peel Strengths When Cured
Patent:
7,956,143 →
Application:
11/107,757 →
Molding Compositions
Patent:
7,683,138 →
Application:
11/129,348 →
Flame-Retardant Molding Compositions
Dual Chamber Piston Pressure Pack Dispenser System
Radiation-curable laminating adhesives
Flame-Retardant Composition for Coating Powders
Cartridge for Caulking Compound, Sealant and/or Adhesives
Corroxion Protective Methacrylate Adhesives for Galvanized Steel and Other Metals
Dual Cure Adhesives
Epoxy Syringe Storage Clip
B-Stageable Die Attach Adhesives
Sprayable Water-Based Adhesive
Application:
11/690,497 →
Publication:
US 2007/0224395
Low Exothermic Thermosetting Resin Compositions Useful as Underfill Sealants and Having Reworkability
Polyamides
Novel Anaerobic Cure Systems for an Anaerobic Curable Compositions, and Anaerobic Curable Compositions Containing Same
Patent:
8,034,851 →
Application:
12/277,932 →
High Pressure Connection Systems and Methods for Their Manufacture
Application:
12/358,798 →
Publication:
US 2009/0188269
Novel Anaerobic Cure Systems for Anaerobic Curable Compositions, and Anaerobic Curable Compositions Containing Same
Patent:
8,188,161 →
Application:
12/358,860 →
Liquid Moisture Curable Polyurethane Adhesives for Lamination and Assembly
Conductive Adhesive Compositions Containing an Alloy Filler Material for Better Dispense and Thermal Properties
Patent:
7,851,930 →
Application:
12/475,634 →
Ultrafast Heat/Room Temperature Adhesive Composition for Bonding Applications
Methods of Dicing Stacked Shingled Strip Constructions to Form Stacked Die Packages
Patent:
8,399,974 →
Application:
12/500,415 →
Moisture Curable Polyamides and Methods for Using the Same
Adhesive Detection Methods
Curable Resin Compositions Useful as Underfill Sealants for Use with Low-K Dielectric-Containing Semiconductor Devices
Liquid Polyurethane Prepolymers Useful in Solvent-Free Adhesives
Hand Held Peristaltic Pump for Dispensing Fluid from a Rigid Container
Organic Acid- or Latent Organic Acid-Functionalized Polymer-Coated Metal Powders for Solder Pastes
Curable Compositions with Moisture-Curable Functionality Clusters Near the Chain Ends
Curable Compositions and Fluid Connections Made Therewith
Application:
12/882,593 →
Adhesive Compositions for Use in Die Attach Applications
Method of Fabricating a Semiconductor Package Using a Fluxing Underfill Composition Applied to Solder Balls in a Dip Process
Apparatus and Methods for Controlled Radical Polymerization
Low Temperature Curing Compositions
Application:
13/027,747 →
Publication:
US 2011/0133330
Method Of Preparing A Mold Sealer, Mold Sealer Assembly And Compositions Thereof
Application:
13/031,399 →
Publication:
US 2011/0139959
Self Adhering Window Flashing Tape with Multi-Directional Drainage Plane
Dry-To-The-Touch-Moisture-Curable Compositions and Products Made Therefrom
Curing Agents for Epoxy Resins
Thermally Decomposable Polymer Coated Metal Powders
Hydrogen Peroxide Complexes and Their Use in the Cure System of Anaerobic Adhesives
Fast,Curing Two Part Anaerobic Adhesive Composition
Extremely High Temperature Wearing Compound
Cure Accelerators for Anaerobic Curable Compositions
Anaerobic Adhesive and Sealant Compositions in Film Form, Film Spool Assemblies Containing Such Compositions in Film Form and Preapplied Versions Thereof on Matable Parts
Robust Adhesives for Laminating Flexible Packaging Material
Cure Accelerators for Anaerobic Curable Compositions
Adhesive Recycling During Spin Coating
Application:
13/305,936 →
Publication:
US 2013/0136858
Curable Silicone Compositions Containing Reactive Non-Siloxane-Containing Resins
Connection Systems for Refrigeration Filter Dryer Units and Methods for Their Manufacture
Application:
13/399,255 →
Publication:
US 2012/0186099
Primer Compositions to Toughen Adhesive Bonds
Thermal Interface Material with Epoxidized Nutshell Oil
Dual Cartridge Pneumatic Dispenser Integrated with Disposable Anti-Drip Valve for Precision Dispensing
Thermal Interface Material with Phenyl Ester
Application:
13/469,679 →
Publication:
US 2012/0279697
Dispensing Gun for a Collapsible Adhesive-Filled Container
Injection Molding Process and Compositions with Improved Sealing Characteristics for Mold-in-Place Gaskets
Coating Adhesives Onto Dicing Before Grinding and Micro-Fabricated Wafers
Silane Moisture Curable Hot Melts
Macro-Photoinitiators and Curable Compositions Thereof
Methods for Making Aqueous Polyurethane Dispersions of Aromatic Polyisocyanate Mixtures and Compositions
Application:
13/632,451 →
Publication:
US 2013/0025784
Controlled Cure Aliphatic Laminating Adhesive Using Non-Migrating Blocking Agents for Organometallic Catalysts
Application:
13/670,603 →
Publication:
US 2013/0078473
Anaerobic Adhesive and Sealant Compositions in Film Form, Film Spool Assemblies Containing Such Compositions in Film Form and Preapplied Versions Thereof on Matable Parts
Adhesive Compositions for Use in Die Attach Applications
Wafer Backside Coating Containing Reactive Sulfur Compound
Application:
13/707,803 →
Publication:
US 2013/0101856
Dual Cure Adhesives
Application:
13/707,891 →
Publication:
US 2013/0102698
Wafer Backside Coating Process with Pulsed Uv Light Source
Chemical Vapor Resistant Epoxy Composition
Application:
13/713,164 →
Publication:
US 2013/0098676
Liquid Compression Molding Encapsulants
Patent:
8,847,415 →
Application:
13/723,336 →
Methods for Measuring Degree of Cure or Soldification of a Composition
Accelerators for Two Step Adhesive Systems
Accelerators for Curable Compositions
Accelerators for Two Part Curable Compositions
Photocurable Dicing Die Bonding Tape
Controlled Radical Polymerization of (Meth)Acrylate Monomers
Accelerator/Oxidant/Proton Source Combinations for Two Part Curable Compositions
Adhesive Compositions
Application:
13/796,482 →
Publication:
US 2013/0189532
Curable Elastomer Compositions with Low Temperature Sealing Capability
Application:
13/796,588 →
Publication:
US 2013/0287980
Composite Film for Board Level Emi Shielding
Sinterable Silver Flake Adhesive for Use in Electronics
B-Stageable and Skip-Curable Wafer Back Side Coating Adhesives
Pre-Cut Wafer Applied Underfill Film on Dicing Tape
Pre-Cut Wafer Applied Underfill Film
Liquid Compression Molding Encapsulants
Wafer Back Side Coating as Dicing Tape Adhesive
Applicator Cap
Patent:
547,181 →
Application:
29/248,853 →
Nut-Like Tape Spool and Cover
Patent:
674,019 →
Application:
29/336,912 →
Controlled Radical Polymerization of (Meth)Acrylic Monomers
Application:
61/714,537 →
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Nov 13, 2013
From: LOCTITE CORPORATION
To: HENKEL LOCTITE CORPORATION
Reel/Frame 031628/0422 →
Change of Name
Nov 13, 2013
From: LOCTITE CORPORATION
To: HENKEL LOCTITE CORPORATION
Reel/Frame 031628/0330 →
Change of Name
Nov 13, 2013
From: LOCTITE CORPORATION
To: HENKEL LOCTITE CORPORATION
Reel/Frame 031628/0378 →
Change of Name
Nov 13, 2013
From: LOCTITE CORPORATION
To: HENKEL LOCTITE CORPORATION
Reel/Frame 031628/0429 →
Change of Name
Nov 13, 2013
From: LOCTITE CORPORATION
To: HENKEL LOCTITE CORPORATION
Reel/Frame 031628/0744 →
Assignment of Assignor's Interest
Nov 13, 2013
From: DEXTER CORPORATION
To: LOCTITE CORPORATION
Reel/Frame 031593/0312 →
Merger
Nov 13, 2013
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 031593/0504 →
Merger
Nov 13, 2013
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 031593/0614 →
Merger
Nov 13, 2013
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 031593/0812 →
Merger
Nov 13, 2013
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 031593/0959 →
Merger
Nov 13, 2013
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 031594/0317 →
Merger
Nov 13, 2013
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 031594/0669 →
Change of Name
Nov 13, 2013
From: LOCTITE CORPORATION
To: HENKEL LOCTITE CORPORATION
Reel/Frame 031628/0237 →
Merger
Nov 18, 2013
From: POWER DEVICES, INC.
To: HENKEL LOCTITE CORPORATION
Reel/Frame 031620/0808 →
Merger
Nov 18, 2013
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 031620/0924 →
Change of Name
Feb 27, 2014
From: LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 032315/0772 →
Merger
Feb 28, 2014
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 032372/0423 →
Assignment of Assignor's Interest
Sep 25, 2014
From: WU, BING; TONG, QUINN K.; SCHULTZ, ROSE ANN
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 033814/0058 →
Merger
Sep 26, 2014
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
To: HENKEL CORPORATION
Reel/Frame 033825/0960 →
Assignment of Assignor's Interest
Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0776 →