Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
View Patent ↗The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
1. Solder particles having a polyalkylene polymer with organic acid or latent organic acid functional groups coated on at least a portion of the surface thereof, wherein the solder particles are made from an alloy selected from the group consisting of tin/silver/copper, tin/zinc, tin/bismuth, tin/lead, and tin/indium/bismuth and wherein the solder particles have a varied size distribution of diameters of about 0.5 to about 100 μm, wherein the polyalkylene is selected from the group consisting of polyethylene, polypropylene, polybutylene and mixtures thereof.
2. A solder paste composition comprising the coated solder particles according to claim 1 and flux.
3. The solder paste composition claim 2 wherein the coated solder particles are present in amount of from about 10 to about 98% by weight with respect to the total component.
4. The solder particles of claim 1 wherein the organic acid or latent organic acid functional groups is selected from maleic anhydride, dimmer acids, steric acid, adipic acid, 12-hydrosteric acid or mixtures thereof.
5. The solder particles of claim 1 wherein the varied distribution of diameters is from about 3 to about 50 μm.
6. The solder particles of claim 1 , wherein the polymer has organic acid functional groups, and wherein the organic acid is a carboxylic acid.
7. Solder particles having a polyalkylene polymer with organic acid or latent organic acid functional groups coated on at least a portion of the surface thereof, wherein the organic acid or latent organic acid coating on one or more of the solder particles is less than about 5 μm in thickness wherein the solder particles are made from an alloy selected from the group consisting of tin/silver/copper, tin/zinc, tin/bismuth, tin/lead, and tin/indium/bismuth and wherein the solder particles have a varied size distribution of diameters of about 0.5 to about 100 μm, wherein the polyalkylene is selected from the group consisting of polyethylene, polypropylene, polybutylene and mixtures thereof.
8. The solder particles according to claim 7 wherein the organic acid or latent organic acid coating on one or more of the solder particles is in the range from about 0.0001 to about 3.0 μm in thickness.
9. The solder particles according to claim 7 wherein the organic acid or latent organic acid coating on one of more of the solder particles is in the range from about from 0.001 to about 1 μm in thickness.