Flame-retardant molding compositions
View Patent ↗A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coast an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.
1. A flame-retardant molding composition substantially free of elemental halogen, phosphorus, and antimony, comprising: an epoxy resin;
about 0.1 to about 4 wt. % based on the weight of the molding composition of melamine cyanurate;
about 0.1 to about 2 wt. % of one or more metal borate salts; and
about 0.1 to about 1 wt. % of a compound selected from the group consisting of polyhydroxides of one or more elements selected from Group IIA elements and Group IIIB elements, one or more Group IIB oxides and mixtures thereof, wherein the Group IIB oxides are present in an amount from about 0.01 to about 1 percent by weight of the molding composition.
2. The molding composition of claim 1 , wherein the metal borate salt comprises zinc borate.
3. The molding composition of claim 1 , wherein the polyhydroxide is a metal polyhydroxide comprising one or more of aluminum trihydrate, magnesium hydroxide, or calcium hydroxide, and the Group IIB oxides comprise zinc oxide.
4. The molding composition of claim 1 , wherein the melamine cyanurate is present in an amount of from about 0.1 to about 3.5 percent by weight of the molding composition; the metal borate salt is present in an amount from about 0.2 to about 1.75 percent by weight of the molding composition; the polyhydroxide is present in an amount from about 0.15 to about 0.85 percent by weight of the molding composition; and the Group IIB oxides are present in an amount from about 0.1 to about 0.85 percent by weight of the molding composition.
5. The molding composition of claim 1 , wherein the metal borate salt comprises zinc borate, the polyhydroxide comprises one or both of aluminum trihydrate or magnesium hydroxide and the Group IIB oxides comprise zinc oxide.
6. The molding composition of claim 1 , further comprising a phenolic novolac hardener.
7. The molding composition of claim 6 , wherein the amount of the phenolic novolac hardener ranges from about 1.5 wt. % to about 10 wt. % based on the total weight of the molding composition.
8. The molding composition of claim 1 , wherein the molding composition comprises an epoxy cresol novolac resin.
9. The molding composition of claim 1 , wherein the molding composition further comprises a biphenyl epoxy resin.
10. The molding composition of claim 1 , wherein the amount of the epoxy resin ranges from about 4 wt. % to about 12 wt. % based on the total weight of the molding composition.
11. The molding composition of claim 10 , wherein the amount of the epoxy resin ranges from about 5.5 wt. % to about 8.5 wt. % based on the total weight of the molding composition.
12. A flame-retardant molding composition substantially free of elemental halogen, phosphorous, and antimony, comprising an epoxy resin, from about 0.1 to about 4 percent by weight of the molding composition of melamine cyanurate, from about 0.1 to about 2 percent by weight of zinc borate, and a compound selected from about 0 to about 1 percent by weight of zinc oxide or from about 0 to about 1 percent by weight of a metal polyhydroxide comprising one or both of aluminum trihydrate and magnesium hydroxide.
13. The molding composition of claim 12 , wherein the melamine cyanurate is present in an amount from about 0.1 to about 3.5 percent by weight of the molding composition; zinc borate is present in an amount from about 0.2 to about 1.75 percent by weight of the molding composition; zinc oxide is present in an amount from about 0.1 to about 1 percent by weight of the molding composition; and the metal polyhydroxide is present in an amount from about 0.1 to about 1 percent by weight of the molding composition.
14. The molding composition of claim 12 , farther comprising a phenolic novolac hardener.
15. The molding composition of claim 14 , wherein the amount of the phenolic novolac hardener ranges from about 1.5 wt. % to about 10 wt. % based on the total weight of the molding composition.
16. The molding composition of claim 12 , wherein the molding composition comprises an epoxy cresol novolac resin.
17. The molding composition of claim 12 , wherein the molding composition further comprises a biphenyl epoxy resin.
18. The molding composition or claim 12 , wherein the amount of the epoxy resin ranges from about 4 wt. % to about 12 wt. % based on the total weight of the molding composition.
19. A flame-retardant molding composition substantially free of elemental halogen, phosphorous, and antimony, consisting essentially of:
about 4 wt. % to about 12 wt. % of an epoxy resin comprising an epoxy cresol novolac resin or a biphenyl epoxy resin;
about 0.1 wt. % to about 3.5 wt. % of melamine cyanurate;
about 0.1 wt. % to about 2 wt % of zinc borate;
about 0.01 wt. % to about 1 wt. % of a compound selected from one or more of zinc oxide or a metal polyhydroxide comprising one or both of aluminum trihydrate and magnesium hydroxide;
about 0.001 wt. % to about 10 wt. % of a phenolic novolac hardener;
about 0 wt. % to about 90 wt. % of one or more solvents; and
about 0.1 wt. % to about 10 wt. % each of one or more additives selected from the group consisting of colorants, mold release agents, coupling agents, catalysts, ion scavengers, metal oxides, metal hydroxides, pigments, adhesion promoters, toughening agents, UV absorbers, and antioxidants.
20. The molding composition of claim 19 , wherein the epoxy resin comprises an epoxy cresol novolac resin.
21. The molding composition of claim 19 , wherein the epoxy resin comprises a biphenyl epoxy resin.
22. A method of coating an electrical or electronic device, comprising heating a molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device; wherein the molding composition, which is substantially free of elemental halogen, phosphorus, and
antimony, comprises:
an epoxy resin;
from about 0.1 to about 4 percent by weight of the molding composition of melamine cyanurate;
from about 0.1 to about 2 percent by weight of one or more metal borate salts; and
from about 0.01 to about 1 percent by weight of a compound selected from zinc oxide or one or more polyhydroxides of one or more elements selected from Group IIA elements and Group IIB elements.
23. The method of claim 22 , wherein the temperature ranges from about 165° C. to about 195° C.
24. The method of claim 22 , wherein the melamine cyanurate is present in the molding composition at from about 0.1 to about 3.5 percent by weight of the molding composition; the metal borate salt is present at from about 0.2 to about 1.75 percent by weight of the molding composition; and the compound selected from zinc oxide or one or more polyhydroxides is present at from about 0.01 to about 0.85 percent by weight of the molding composition.
25. The method of claim 22 , wherein the metal borate salt comprises zinc borate and the polyhydroxide is a metal polyhydroxide comprising one or both of aluminum trihydrate or magnesium hydroxide.
26. The method of claim 22 , wherein the molding composition further comprises a phenolic novolac hardener.
27. The method of claim 26 , wherein the amount of the phenolic novolac hardener ranges from about 1.5 wt. % to about 10 wt. % based on the total weight of the molding composition.
28. The method of claim 22 , wherein the molding composition contains an epoxy cresol novolac resin.
29. The method of claim 22 , wherein the molding composition further contains a biphenyl epoxy resin.
30. The method of claim 22 , wherein the amount of the epoxy resin in the molding composition ranges from about 4 wt. % to about 12 wt. % based on the total weight of the molding composition.
31. The method of claim 30 , wherein the amount of the epoxy resin in the molding composition ranges from about 5.5 wt. % to about 8.5 wt. % based on the total weight of the molding composition.
32. The method of claim 22 , wherein the device is an electrical or electronic device.
33. The method of claim 32 , wherein the electrical or electronic device is selected from a semiconductor, a transistor, a diode, or an integrated circuit.
34. An electrical or electronic device formed by the method of claim 22 .