IP Library Granted Patent US 8,546,485
Granted Patent B2
US 8,546,485 · App. 13/785,488 · Granted Oct 1, 2013

Photocurable dicing die bonding tape

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Quick Facts
Patent No.
US 8,546,485
App. No.
13/785,488
Granted
Oct 1, 2013
Kind
B2
Abstract

A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.

Claims (5)

1. A pressure sensitive adhesive composition comprising:

(A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation, and

(B) hydrophobic polymers terminated with carbon-carbon unsaturation.

2. The pressure sensitive adhesive composition of claim 1 further comprising a polyisocyanate in an amount effective to partially crosslink the (A) and (B) polymers of the composition.

3. The pressure sensitive adhesive composition of claim 2 in which the polyisocyanate is selected from the group consisting of diisophorone diisocyanate, toluene diisocyanate, diphenylmethane diisocyanate, and 1,5-naphthalene diisocyanate.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0776 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034184/0396 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2013
From: LEE, BYOUNGCHUL; CHIANG, PAULINE; BECKER, KEVIN
To: HENKEL CORPORATION
Reel/Frame 030804/0882 →