Liquid compression molding encapsulants
View Patent ↗Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials.
1. A liquid compression molding curable resin composition, comprising a curable resin matrix, a cure component comprising a cationic catalyst and an oxidant, wherein when cured the composition exhibits a DSC peak below 140° C. and a delta temperature between the onset temperature and the peak on DSC below 20° C.
2. The composition of claim 1 , wherein when cured the composition exhibits a modulus in the range of about 2,200 MPas or less at 25° C. and multiple Tgs.
3. The composition of claim 2 , wherein the multiple Tgs include a T g1 of about −70° C. to −30° C. and a T g2 of about 100° C. to 150° C.
4. The composition of claim 1 , wherein the curable resin comprises an epoxy resin component and a (meth)acrylate functional polymer component.
5. The composition of claim 4 , wherein the curable resin further comprises an episulfide resin component, an oxazine component, an oxazoline component, a cyanate ester component, and/or a maleimide-, a nadimide- or an itaconimide-containing component.
6. The composition of claim 1 , wherein the curable resin further comprises an episulfide resin component, an oxazine component, an oxazoline component, a cyanate ester component, and/or a nadimide- or an itaconimide-containing component.
7. The composition of claim 1 , wherein when cured the composition exhibits a Tg higher than 90° C.
8. The composition of claim 7 , wherein when cured the composition exhibits a Tg higher than 125° C.
9. The composition of claim 1 , wherein when cured the composition exhibits a DMA storage modulus of less than 3,253 MPa at −65° C.
10. The composition of claim 1 , wherein when cured the composition exhibits a DMA storage modulus of less than 2,625 MPs at 25° C.
11. The composition of claim 1 , wherein when cured the composition exhibits a DMA storage modulus of less than 1,676 MPa at 100° C.
12. The composition of claim 1 , wherein when cured the composition exhibits a DMA storage modulus of less than 145 MPa at 150° C.
13. The composition of claim 1 , wherein when cured the composition exhibits a DMA storage modulus of less than 79 MPa at 200° C.
14. The composition of claim 1 , wherein when cured the composition exhibits a DMA storage modulus of less than 85 MPa at 250° C.