IP Library › Assignment 027172/0043
Patent Assignment
Reel/Frame 027172/0043

Assignment of Assignor's Interest

Recorded: 2011-11-03 Pages: 5
Assignors
QIAN, YIN
Executed: 2011-10-31
TAI, HSIN-CHIH
Executed: 2011-10-31
KU, KEH-CHIANG
Executed: 2011-10-31
VENEZIA, VINCENT
Executed: 2011-11-01
MAO, DULI
Executed: 2011-10-31
ZHENG, WEI
Executed: 2011-10-31
RHODES, HOWARD E.
Executed: 2011-10-31
Assignee
OMNIVISION TECHNOLOGIES, INC.
4275 BURTON DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Pad Design for Circuit Under Pad in Semiconductor Devices
Patent: 8,569,856 →
Application: 13/288,731 →
Publication: US 2013/0113065