Patent Assignment
Reel/Frame 027177/0302
Assignment of Assignor's Interest
Recorded: 2011-11-04
Pages: 2
Assignor
CUI, HUA
Executed: 2011-08-30
Assignee
EKC TECHNOLOGY, INC.
2520 BARRINGTON COURT, HAYWARD, CALIFORNIA, 94545
Covered Property
(1)
Method and Composition for Removing Resist, Etch Residue, and Copper Oxide from Substrates Having Copper, Metal Hardmask and Low-K Dielectric Material
Application:
13/209,859 →
Publication:
US 2013/0045908