Patent Assignment
Reel/Frame 027177/0980
Assignment of Assignor's Interest
Recorded: 2011-11-04
Pages: 3
Assignors
SASAKI, SHINYA
Executed: 2011-10-31
TAKEBAYASHI, YUJI
Executed: 2011-10-31
KOGURA, SHINTARO
Executed: 2011-10-31
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Title to Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Semiconductor Device Previously Recorded on Reel 027177 Frame 0980. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Dec 2, 2011
From: SASAKI, SHINYA; TAKEBAYASHI, YUJI; KOGURA, SHINTARO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 027316/0065 →
Assignment of Assignor's Interest
Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →