Patent Assignment
Reel/Frame 027184/0771
Assignment of Assignor's Interest
Recorded: 2011-11-07
Pages: 4
Assignors
LEE, CHANGHYUN
Executed: 2011-11-07
PARK, CHANJIN
Executed: 2011-11-07
SON, BYOUNGKEUN
Executed: 2011-11-07
CHANG, SUNG-IL
Executed: 2011-11-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Devices and Methods of Fabricating the Same