Patent Assignment
Reel/Frame 027193/0731
Assignment of Assignor's Interest
Recorded: 2011-11-08
Pages: 3
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D, STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property
(1)
Method for Forming an Air Gap Around a Through-Silicon Via
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.