Assignment of Assignor's Interest

Recorded: 2011-11-09 Pages: 2

Assignor

MORI, SHIGERU

Executed: 2007-03-12

Assignees

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

NEC LCD TECHNOLOGIES, LTD.

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN

Covered Property (1)

Method of Manufacturing a Semiconductor Device with a Front-End Insulating Layer Interposed Between a Semiconductor Layer and an Insulating Substrate

Patent: 8,431,447 →

Application: 13/291,450 →

Publication: US 2012/0058646

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.