IP Library › Assignment 030074/0579
Patent Assignment
Reel/Frame 030074/0579

Change of Name

Recorded: 2013-03-25 Pages: 7
Assignor
NEC LCD TECHNOLOGIES, LTD.
Executed: 2011-07-01
Assignee
NLT TECHNOLOGIES, LTD.
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JAPAN
Covered Property (1)
Method of Manufacturing a Semiconductor Device with a Front-End Insulating Layer Interposed Between a Semiconductor Layer and an Insulating Substrate
Patent: 8,431,447 →
Application: 13/291,450 →
Publication: US 2012/0058646
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 9, 2011
From: MORI, SHIGERU
To: NEC CORPORATION; NEC LCD TECHNOLOGIES, LTD.
Reel/Frame 027195/0997 →
Assignment of Assignor's Interest Aug 19, 2016
From: NEC CORPORATION
To: NEC LCD TECHNOLOGIES, LTD.
Reel/Frame 039484/0218 →