Patent Assignment
Reel/Frame 027204/0231
Assignment of Assignor's Interest
Recorded: 2011-10-21
Pages: 3
Assignor
KIMURA, NORIYUKI
Executed: 2011-10-03
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Ball grid array semiconductor package and method of manufacturing the same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.