Patent Assignment
Reel/Frame 027222/0164
Assignment of Assignor's Interest
Recorded: 2011-11-14
Pages: 3
Assignor
SAKAI, SHUNSUKE
Executed: 2011-11-02
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board and Method for Manufacturing the Same