IP Library › Assignment 027222/0872
Patent Assignment
Reel/Frame 027222/0872

Assignment of Assignor's Interest

Recorded: 2011-11-14 Pages: 3
Assignor
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Wafer-Level Packaging Method Using Composite Material as a Base
Patent: 8,502,367 →
Application: 12/893,651 →
Publication: US 2012/0074592
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 29, 2010
From: LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 025063/0361 →
Assignment of Assignor's Interest Nov 14, 2011
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027226/0857 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →