Patent Assignment
Reel/Frame 027234/0270
Assignment of Assignor's Interest
Recorded: 2011-11-16
Pages: 4
Assignees
BONDTECH, INC.
1-25, NISHINOHATA, OKUBO-CHO, UJI-SHI, KYOTO, 611-0033, JAPAN
TADATOMO SUGA
3-6-3, HIGASHINAKANO, NAKANO-KU, TOKYO, 164-0003, JAPAN
Covered Property
(1)
Joining Method and Device Produced by This Method and Joining Unit
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.