Patent Assignment
Reel/Frame 027237/0644
Assignment of Assignor's Interest
Recorded: 2011-11-16
Pages: 8
Assignors
PARK, SANG-YONG
Executed: 2011-10-27
PARK, JINTAEK
Executed: 2011-11-16
KIM, HANSOO
Executed: 2011-11-16
CHUNG, JUHYUCK
Executed: 2011-10-25
CHO, WONSEOK
Executed: 2011-11-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
3D Semiconductor Devices and Methods of Fabricating Same