Patent Assignment
Reel/Frame 027244/0878
Assignment of Assignor's Interest
Recorded: 2011-10-24
Pages: 2
Assignors
LEE, CHANGHYUN
Executed: 2011-10-14
CHANG, SUNG-IL
Executed: 2011-10-14
SON, BYOUNGKEUN
Executed: 2011-10-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Nonvolatile Memory Device in Three-Dimensional Structure with a Stress Reducing Materials on the Channel