IP Library Assignment 027250/0356
Patent Assignment
Reel/Frame 027250/0356

Assignment of Assignor's Interest

Recorded: 2011-11-18 Pages: 20
Assignors
TSOI, VADIM
Executed: 2011-11-15
HENNINGSON, UNO
Executed: 2011-11-15
HONG, YUPING
Executed: 2011-11-14
PENG, FENG
Executed: 2011-11-14
YANG, HUA
Executed: 2011-11-14
LI, HAIPENG
Executed: 2011-11-14
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, P.R., 518129, CHINA
Covered Property (1)
Heat Spreading Device and Method with Sectioning Forming Multiple Chambers
Patent: 9,423,192 →
Application: 13/299,431 →
Publication: US 2012/0111553