Patent Assignment
Reel/Frame 027252/0934
Assignment of Assignor's Interest
Recorded: 2011-11-18
Pages: 2
Assignors
LIU, HAO-JUIN
Executed: 2011-09-23
CHUANG, CHITA
Executed: 2011-09-23
KUO, CHEN-CHENG
Executed: 2011-09-23
CHEN, CHEN-SHIEN
Executed: 2011-09-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method