Patent Assignment
Reel/Frame 027269/0375
Assignment of Assignor's Interest
Recorded: 2011-11-22
Pages: 4
Assignors
HUANG, KUEI-WEI
Executed: 2011-10-17
LIN, WEI-HUNG
Executed: 2011-10-17
LIN, CHIH-WEI
Executed: 2011-10-17
LIN, CHUN-CHENG
Executed: 2011-10-17
CHEN, MENG-TSE
Executed: 2011-10-17
CHENG, MING-DA
Executed: 2011-10-17
LIU, CHUNG-SHI
Executed: 2011-10-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaging Methods for Semiconductor Devices Including Forming Trenches in Workpiece to Separate Adjacent Packaging Substrates