Patent Assignment
Reel/Frame 027275/0637
Assignment of Assignor's Interest
Recorded: 2011-11-23
Pages: 2
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Semiconductor Wafer Transport Method and Semiconductor Wafer Transport Apparatus