Patent Assignment
Reel/Frame 027276/0641
Assignment of Assignor's Interest
Recorded: 2011-11-23
Pages: 4
Assignors
LIN, JING-CHENG
Executed: 2011-11-09
HUANG, CHENG-LIN
Executed: 2011-11-09
LU, SZU WEI
Executed: 2011-11-09
HUNG, JUI-PIN
Executed: 2011-11-09
JENG, SHIN-PUU
Executed: 2011-11-09
YU, CHEN-HUA
Executed: 2011-11-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Packages Including Active Dies and Dummy Dies and Methods for Forming the Same