IP Library › Assignment 027290/0124
Patent Assignment
Reel/Frame 027290/0124

Assignment of Assignor's Interest

Recorded: 2011-11-29 Pages: 3
Assignors
HOWARD, GREGORY E
Executed: 2011-11-21
ROMIG, MATTHEW D
Executed: 2011-11-18
MILLERON, MARIE-SOLANGE A
Executed: 2011-11-18
MUKHERJEE, SOUVIK
Executed: 2011-11-21
Assignee
TEXAS INSTRUMENTS INCORPORATED
P. O. BOX 655474, MS 3999, DALLAS, TEXAS, 75265
Covered Property (1)
Structure for High-Speed Signal Integrity in Semiconductor Package with Single-Metal-Layer Substrate
Patent: 8,723,337 →
Application: 13/306,486 →
Publication: US 2013/0134579