Patent Assignment
Reel/Frame 027299/0118
Assignment of Assignor's Interest
Recorded: 2011-11-30
Pages: 5
Assignors
SIDOROV, VICTOR
Executed: 2011-11-05
ZHYTNYTSKA, RIMMA
Executed: 2011-10-26
WUERFL, JOACHIM
Executed: 2011-10-18
Assignee
FORSCHUNGSVERBUND BERLIN E.V.
RUDOWER CHAUSSEE 17, BERLIN, 12489, GERMANY
Covered Property
(1)
Method for Producing a Metallization Having Two Multiple Alternating Metallization Layers for at Least One Contact Pad and Semiconductor Wafer Having Said Metallization for at Least One Contact Pad
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.