Patent Assignment
Reel/Frame 027314/0473
Assignment of Assignor's Interest
Recorded: 2011-12-01
Pages: 6
Assignors
YU, CHEN-HUA
Executed: 2011-11-23
CHIU, CHIEN-CHIA
Executed: 2011-11-22
HSIEH, CHENG-CHIEH
Executed: 2011-11-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interposer Wafer Bonding Method and Apparatus