Patent Assignment
Reel/Frame 027325/0763
Assignment of Assignor's Interest
Recorded: 2011-12-03
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2011-10-05
LIU, CHUNG-SHI
Executed: 2011-10-05
LII, MIRNG-JI
Executed: 2011-10-06
CHENG, MING-DA
Executed: 2011-10-05
LIN, CHIH-WEI
Executed: 2011-10-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package-On-Package (Pop) Structure Having at Least One Package Comprising One Die Being Disposed in a Core Material Between First and Second Surfaces of the Core Material.