IP Library › Assignment 027326/0772
Patent Assignment
Reel/Frame 027326/0772

Assignment of Assignor's Interest

Recorded: 2011-12-05 Pages: 3
Assignors
NIEH, CHUN-FENG
Executed: 2011-09-15
YU, CHUNG-YI
Executed: 2011-09-15
LIN, HUNG-TA
Executed: 2011-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Forming a Protective Film on a Back Side of a Silicon Wafer in a Iii-V Family Fabrication Process
Patent: 8,629,037 →
Application: 13/244,340 →
Publication: US 2013/0078783