Patent Assignment
Reel/Frame 027327/0143
CHANGE OF NAME
Recorded: 2011-12-05
Received: 2011-12-05
Pages: 14
Assignor
FUJITSU MICROELECTRONICS LIMITED
Executed: 2010-04-01
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, JPX, 222-0033, JAPAN
Covered Applications
(31)
METHOD OF INSPECTING MASK PATTERN AND MASK PATTERN INSPECTION APPARATUS
App. No. 12/708,041
→
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, PRINTED CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND POWER SUPPLY WIRING STRUCTURE
App. No. 12/204,677
→
ANTENNA APPARATUS UTILIZING APERTURE OF TRANSMISSION LINE
App. No. 12/155,247
→
SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
App. No. 11/889,100
→
SEMICONDUCTOR DEVICE WITH VIA HOLE OF UNEVEN WIDTH
App. No. 11/808,667
→
Scheduling in a multicore processor
App. No. 11/540,146
→
MANAGING POWER CONSUMPTION IN A MULTICORE PROCESSOR
App. No. 11/541,315
→
NARROW IMPEDANCE CONVERSION DEVICE
App. No. 11/500,943
→
METHOD FOR DESIGNING A SEMICONDUCTOR INTEGRATED CIRCUIT LAYOUT CAPABLE OF REDUCING THE PROCESSING TIME FOR OPTICAL PROXIMITY EFFECT CORRECTION
App. No. 11/486,107
→
SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
App. No. 11/213,882
→
HIGH-RELIABLE SEMICONDUCTOR DEVICE USING HERMETIC SEALING OF ELECTRODES
App. No. 11/212,912
→
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
App. No. 11/182,024
→
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE DEVICE
App. No. 11/077,212
→
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
App. No. 11/055,707
→
DEBUG IN A MULTICORE ARCHITECTURE
App. No. 10/941,457
→
SIGNAL TRANSMISSION SYSTEM, AND SIGNAL TRANSMISSION LINE
App. No. 10/898,874
→
RESOURCE MANAGEMENT IN A MULTICORE ARCHITECTURE
App. No. 10/816,328
→
ELECTRONIC CIRCUIT DEVICE
App. No. 10/781,942
→
SIGNAL TRANSMISSION APPARATUS AND INTERCONNECTION STRUCTURE
App. No. 10/775,223
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/603,982
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SURFACE INSPECTION METHOD AND SURFACE INSPECTION SYSTEM
App. No. 10/393,833
→
METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CONSTANT INSULATOR FILM
App. No. 10/391,022
→
SEMICONDUCTOR DEVICE WITH BUILT-IN LIGHT RECEIVING ELEMENT, PRODUCTION METHOD THEREOF, AND OPTICAL PICKUP INCORPORATING THE SAME
App. No. 10/384,774
→
SIGNAL TRANSMISSION SYSTEM
App. No. 10/353,040
→
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
App. No. 10/350,420
→
WIRING SUBSTRATE
App. No. 10/228,305
→
METHOD FOR MANUFACTURING AN INTERCONNECT STRUCTURE FOR STACKED SEMICONDUCTOR DEVICE
App. No. 09/997,878
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WIRING STRUCTURE FOR TRANSMISSION LINE HAVING GROOVED CONDUCTORS
App. No. 09/988,017
→
A SEMICONDUCTOR INTERGRATED CIRCUIT HAVING SWITCHING TRANSISTORS AND VARACTORS
App. No. 09/963,500
→
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE DEVICE
App. No. 09/898,082
→
DRIVER CIRCUIT, RECEIVER CIRCUIT, AND SIGNAL TRANSMISSION BUS SYSTEM
App. No. 09/761,583
→