Semiconductor device and process for manufacturing the same
View Patent ↗The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
1. A semiconductor device comprising a first substrate on which one or more electrodes are formed, a second substrate on which one or more electrodes are formed, elastic bumps formed on the one or more electrodes on the second substrate, a spring constant of the elastic bump being 1000 N/m or lower,
wherein surfaces of the one or more electrodes on the first substrate and surfaces of the elastic bumps formed on the one or more electrodes on the second substrate are electrically connected by bonding.
2. The semiconductor device according to claim 1 , wherein the elastic bump is a spring bump.
3. The semiconductor device according to claim 1 , wherein the elastic bump is a resin core-type bump.
4. The semiconductor device according to claim 1 , wherein the elastic bump is a hollow bump.
5. A kit for manufacturing a semiconductor device in which a first substrate on which one or more electrodes are formed and a second substrate on which one or more electrodes are formed are electrically connected via elastic bumps, which comprises a first substrate on which one or more electrodes are formed, a second substrate on which one or more electrodes are formed, and elastic bumps formed on the one or more electrodes on the second substrate,
wherein surfaces of the one or more electrodes on the first substrate have a root mean square roughness of 10 nm or lower, and surfaces of the elastic bumps formed on the one or more electrodes on the second substrate have a root mean square roughness of 10 nm or lower.