Patent Assignment
Reel/Frame 027335/0106
Assignment of Assignor's Interest
Recorded: 2011-12-07
Pages: 3
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Offset of Contact Opening for Copper Pillars in Flip Chip Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.