Patent Assignment
Reel/Frame 027341/0053
Assignment of Assignor's Interest
Recorded: 2011-12-07
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2011-11-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structure Design for Stress Reduction