Patent Assignment
Reel/Frame 027348/0936
Assignment of Assignor's Interest
Recorded: 2011-12-07
Pages: 5
Assignors
CHANG, SHU-MING
Executed: 2011-11-28
CHEN, CHIEN-HUI
Executed: 2011-11-28
HO, YEN-SHIH
Executed: 2011-11-28
LIU, CHIEN-HUNG
Executed: 2011-11-28
YIU, HO-YIN
Executed: 2011-11-28
WEN, YING-NAN
Executed: 2011-11-28
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI CITY, TAOYUAN COUNTRY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same