Patent Assignment
Reel/Frame 027350/0828
Assignment of Assignor's Interest
Recorded: 2011-12-08
Pages: 2
Assignors
LIN, CHEN-HAN
Executed: 2011-07-28
CHANG, HONG-DA
Executed: 2011-07-28
LIU, CHENG-HSIANG
Executed: 2011-07-28
LIAO, HSIN-YI
Executed: 2011-07-28
CHIU, SHIH-KUANG
Executed: 2011-07-28
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Method for Fabricating Package Structure Having Mems Elements