Patent Assignment
Reel/Frame 027352/0883
Assignment of Assignor's Interest
Recorded: 2011-12-08
Pages: 2
Assignors
YANG, CHUNG-YING
Executed: 2011-09-28
CHEN, HSIEN-WEI
Executed: 2011-09-28
YU, TSUNG-YUAN
Executed: 2011-09-28
LIANG, SHIH-WEI
Executed: 2011-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Wafer Level Chip Scale Package and Method of Manufacturing the Same