Assignment of Assignor's Interest

Recorded: 2011-12-13 Pages: 3

Assignor

ZHANG, JOHN H.

Executed: 2011-12-09

Assignee

STMICROELECTRONICS, INC.

MAIL STATION 2346, 750 CANYON DRIVE, SUITE 300, COPPELL, TEXAS, 75019

Covered Property (1)

Using Backside Passive Elements for Multilevel 3D Wafers Alignment Applications

Patent: 8,921,976 →

Application: 13/324,791 →

Publication: US 2012/0187530

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.