Assignment of Assignor's Interest

Recorded: 2011-12-19 Pages: 10

Assignors

PAWLIK, ANDREAS

Executed: 2011-11-10

ROOS, MARTIN

Executed: 2011-11-10

BAUMANN, FRANZ-ERICH

Executed: 2011-11-10

HAEGER, HARALD

Executed: 2011-11-09

Assignee

EVONIK DEGUSSA GMBH

RELLINGHAUSER STRASSE 1-11, ESSEN, 45128, GERMANY

Covered Property (1)

Molding Compound on the Basis of a Copolyamide Containing Terephthalic Acid and Trimethylhexamethylene Diamine Units

Patent: 8,871,862 →

Application: 13/377,949 →

Publication: US 2012/0095161

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.